Supply of copper adhesive polymerization, polymerization of copper paste, suitable for circuit board repair, can lead solder furnace does not come off, plus free solder mask covered, single-sided, double sided, multilayer boards are available, breaking the circuit surface, thickness and material constraints . Drying conditions: Screen Printing 150 ° C after 30 minutes to bake. 200 ~ 300 can be used screen printing purposes. Applicable to all kinds of bakelite, glass, ceramics, glass fiber and other materials.